Article
  • Cure Behavior and Thermal Stability of Epoxy/phenol Mixtures
  • Lee YJ, Lee KJ, Kim DS, Yoo HY, Lee JR
  • 에폭시-페놀 수지혼합물의 경화거동과 열안정성
  • 이윤준, 이기준, 김대수, 유회열, 이재락
Abstract
The cure behavior and thermal stability of epoxy resin(diglycidyl ether of bisphenol A,DGEBA) containing 0, 20, 40 phr of phenol resin were investigated. 4,4'-diaminodiphenyl methane(DDM) was used as a curing agent for the epoxy resin. The conversion rate of the epoxy/phenol resin mixtures was lower than that of the neat epoxy resin during isothermal curing at 120℃. The activation energy for the epoxy/phenol resin mixtures calculated from dynamic DSC thermograms was about 75% higher than that of the neat epoxy resin. Gel time increased as the phenol resin was added to the epoxy resin. The glass transition temperature and impact strength of the epoxy/phenol blends decreased with increasing phenol resin content. Thermal degradation delayed as the phenol resin was incorporated. As the phenol resin was added to the epoxy resin, the curing process for epoxide group could not be complete due to the lack of the curing agent. So the crosslinking network structure was not developed sufficiently during curing of the epoxy/phenol blends.

에폭시수지(diglycidyl ether of bisphenol A, DGEBA)에 페놀수지를 각각 0, 20, 40phr 첨가한 혼합수지에 대한 경화특성과 열안정성을 검토하였다. 에폭시수지의 경화제로는 4,4'-diaminodiphenyl methane (DDM)을 사용하였다. 120℃의 등온경화조건에서 혼합수지의 경화속도는 순수한 에폭시수지의 경화속도보다 전반적으로 낮아졌다. DSC를 이용한 승온경화실험결과로부터 구한 혼합수지들의 활성화에너지는 순수한 에폭시수지의 활성화에너지보다 약 75% 정도 높아졌다. Gel time은 혼합수지가 순수한 에폭시수지보다 더 시연되는 것을 확인할 수 있었다. 페놀수지를 혼합 시킴으로 인하여 유리전이온도와 충격강도는 저하되었으나 열분해 온도는 높아졌다. 페놀수지를 첨가한 경우, 경화제 함량이 충분하지 못한 원인으로 인해 혼합수지는 완전히 경화된 상태에 이르지 못하였으며 이에 따른 가교밀도의 저하 때문에 완전한 3차원 망상구조가 형성되지 못하였다.

Keywords:

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1994; 18(2): 206-211

    Published online Mar 25, 1994

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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