Article
  • Study on the Thermal Decomposition Behavior of [ABS/PC/Triphenyl Phosphate/Transition Metal Chloride] Compounds
  • Jang J, Kim JH, Bae JY
  • [ABS/PC/Triphenyl Phosphate/Transition Metal Chloride] 컴파운드의 열분해 거동 연구
  • 장준원, 김진환, 배진영
Abstract
The thermal degradation of ABS/PC/triphenyl phosphate compounds in the presence of transition metal chloride catalysts has been studied by thermogravimetric analysis (TGA). The reaction of transition metal chloride catalysts (cobalt chloride, ferric chloride, nickel chloride and zinc chloride) and ABS/PC/triphenyl phosphate compounds has been found to occur during the thermal degradation of the compounds. In a nitrogen atmosphere, char formation is observed, and 3~13% of the reaction product is non-volatile at 600 ℃. The resulting enhancement of char formation in a nitrogen atmosphere has been explained as a catalytic crosslinking effect of transition metal chloride catalysts. On the other hand, transition metal chloride catalyzed char formation of ABS/PC/triphenyl phosphate compounds in air was unsuccessful due to the oxidative degradation of the char at a higher temperature.

Chloride계 전이금속 촉매의 존재 하에서 ABS/PC/triphenyl phosphate 컴파운드의 열분해 거동을 TGA(thermogravimetric analysis)를 통해서 조사하였다. Chloride계 전이금속 촉매(cobalt chloride, ferric chloride, nickel chloride 및 zinc chloride)는 ABS/PC/triphenyl phosphate 컴파운드의 열분해 과정에서 화학반응을 야기하여, 질소분위기에서 숯(char) 형성이 관찰되었으며, 600 ℃에서 3~13%의 비휘발성 숯을 형성하였다. 이와 같은 질소분위기에서의 ABS/PC/triphenyl phosphate 컴파운드의 숯 생성은 chloride계 전이금속 촉매의 가교효과(crosslinking effect)로 추정된다. 한편, 공기분위기에서는 생성된 숯은 고온 산화반응에 의해서 열분해되었다.

Keywords: ABS; thermal degradation; transition metal chloride catalyst

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2005; 29(4): 338-343

    Published online Jul 25, 2005

  • 10.7317/pk.
  • Received on Jan 11, 2005
  • Revised on Nov 30, -0001
  • Accepted on May 11, 2005

Correspondence to

  • E-mail: