Article
  • A Study on Emulsion Copolymerization of α,ω-Diacrylate Poly(dimethylsiloxane) Containing Vinyl Ester of Versatic Acid/Vinyl Acetate
  • Naghash HJ, Mallakpour S, Forushani PY, Uyanik N
  • Versatic Acid/Vinyl Acetate의 비닐 에스테르를 가지는 α,ω-Diacrylate Poly(dimethylsiloxane)의 에멀션 공중합 연구
  • Naghash HJ, Mallakpour S, Forushani PY, Uyanik N
Abstract
The α,ω-diacrylate poly(dimethylsiloxane) (DA-PDMS) containing vinyl ester of versatic acid/vinyl acetate (Veova-10/VAc) was prepared by emulsion copolymerization of (DA-PDMS), Veova-10 (with VAc), and auxiliary agents at 85 ℃ in the presence of ammonium peroxodisulfate (APS) as an initiator. Sodium dodecyl sulfate (SDS) and nonylphenol ethylene oxide-40 units (NP-40) were used as anionic and nonionic emulsifiers, respectively. The resulting copolymers were characterized by using Fourier transform infrared spectroscopy (FT-IR). Thermal properties of the copolymers were studied by using thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The morphology of copolymers was also investigated by scanning electron microscopy (SEM) and then the effects of variables such as temperature, agitation speed, surfactant kinds, molecular weights, initiator, and DA-PDMS concentrations on the properties of the silicone-containing Veova-10/VAc emulsions were examined. The calculation of monomer conversion versus time histories indicates that by increasing the DA-PDMS concentration the polymerization rate and the number of polymer particles decrease, respectively.

Keywords: emulsion copolymerization; silicone containing emulsions; α,ω-diacrylate poly(dimethylsiloxane); vinyl ester of versatic acid; vinyl acetate

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2008; 32(2): 95-102

    Published online Mar 25, 2008

  • 10.7317/pk.
  • Received on Aug 21, 2007
  • Revised on Nov 30, -0001
  • Accepted on Jan 19, 2008

Correspondence to

  • E-mail: