Article
  • Preparation of the Conducting Polyaniline-HIPS Blends for Injection Molding by Toluene Solution Casting
  • Lee JH, Kim EO
  • Toluene 용액 캐스팅에 의한 사출용 전도성 Polyaniline-HIPS 블렌드 제조
  • 이종혁, 김은옥
Abstract
Polyaniline Emeraldine salt (PANI-salt) prepared by the common chemical oxidative polymerization caused the corrosion of the metallic injection mold by protonic acid such as HCl which used as a dopant. PANI-salt, polyaniline doped with dodecylbenzenesulfonic acid (DBSA), was obtained by the emulsion polymerization in nonpolar organic solvent, toluene. In this study DBSA was used as a dopant along with a surfactant. PANI-salt and high impact polystyrene (HIPS) have a good solubility in toluene. Blends with different ratio of PANI and HIPS were prepared through a solution-cast blending. The structure of PANI-salt was characterized by FT-IR and UV-Vis. The morphology, thermal, and electrical properties for PANI-HIPS blends were investigated. Injection molded under 103 ℃, 120 psi, PANIHIPS showed the highest electrical conductivity (6.02×10^(-5) S/cm) after blending PANI (50 mL) and HIPS (1 g).

화학적 산화중합에 의한 polyaniline emeraldine salt(PANI-salt)는 도펀트로 존재하는 HCl과 같은 양성 자산으로 인한 금속성 사출금형 부식이 발생한다. 본 연구에서는 비극성 유기용매인 톨루엔, 도펀트와 계면활성제 역할을 하는 dodecylbenzenesulfonic acid(DBSA)를 사용하여 유화 중합법으로 PANI-salt를 합성한 후, 공용매 toluene에서 PANI-salt와 high impact polystyrene(HIPS)를 다양한 비율로 solution-cast 혼합하여 PANI-HIPS 블렌드를 얻었다. FT-IR과 UV-Vis.로 PANI-salt 구조를 확인하였고, PANI-HIPS 블렌드의 모폴로지, 열적 및 전기적 특성을 확인하였다. PANI(50 mL)와 HIPS(1 g)을 혼합하여 사출온도 103 ℃, 사출압력 120 psi 하에서 사출한 PANI-HIPS 사출품에서 가장 높은 전기전도도(6.02×10^(-5) S/cm)가 나타났다.

Keywords: injection molding; polyaniline-HIPS blend; solution-cast blending; emulsion polymerization; conducting polymer.

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(3): 203-206

    Published online May 25, 2009

  • 10.7317/pk.
  • Received on Oct 20, 2008
  • Revised on Nov 30, -0001
  • Accepted on Jan 19, 2009

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