Article
  • Colorless and Transparent Polyimide Films from Poly(amic acid)s with Cross-linkable Anhydride End
  • Min U, Chang JH
  • 가교 반응이 가능한 말단 무수물을 이용한 무색투명한 폴리이미드 필름
  • 민웅기, 장진해
Abstract
Crosslinked PI films were synthesized from 4,4′-(hexafluoro isopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy) phenyl] sulfone(BAPS) with various ratios of the reactive monomer cis-4-cyclohexene-1,2-dicarboxylic anhydride(CDBA). We prepared crosslinked poly(amic acid) (PAA) using a 0.1 wt% Grubbs catalyst as a crosslinking agent. The crosslinked PAA was heat-treated at different temperatures to give PI films. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry(DSC), thermogravimetric analysis(TGA), thermomechanical analysis(TMA), and universal tensile machine(UTM), and their optical transparencies were investigated using UV-vis. spectrophotometry. The thermomechanical properties of the PI films improved with increasing CDBA content. However, the optical transparency of the PI films decreased slightly with increasing CDBA content.

4,4′-(Hexafluoroisopropylidene)diphthalic anhydride(6FDA)와 bis[4-(3-amino phenoxy)phenyl] sulfone(BAPS)의 조성에 cis-4-cyclohexene-1,2-dicarboxylic anhydride(CDBA)를 다양한 몰%로 사용하여 사슬 말단에 가교 반응이 된 폴리이미드(PI)를 얻었다. Grubbs 촉매 0.1 wt%를 사용하여 가교된 폴리아믹산(poly(amic acid), PAA)을 합성한 후에 PAA를 다양한 온도에서 열처리를 통해 가교된 PI 필름을 합성하였다. 제조된 필름의 열적-기계적 성질은 퓨리에 변환 적외선 분광기(FTIR), 시차주사 열량계(DSC), 열중량 분석기(TGA), 열기계 분석기(TMA), 만능인장 시험기(UTM) 등을 사용하여 측정하였고, 색차계(spectrophotometer)와 자외선-가시광선 흡광도기(UV-Vis. spectrometer)를 이용하여 광학적 특성을 확인하였다. CDBA의 몰%가 증가함에 따라 열적·기계적 성질은 증가하였지만 광학적 투명도는 이와는 반대로 감소하였다.

Keywords: colorless polyimide; crosslinking; reactive monomer; Grubbs catalyst

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2010; 34(6): 495-500

    Published online Nov 25, 2010

  • 10.7317/pk.
  • Received on Mar 11, 2010
  • Revised on Nov 30, -0001
  • Accepted on Jul 5, 2010

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