Article
  • Synthesis and Thermal Stability of Polyimide-amids Containing Silicones
  • Yoon KS, Sung YK, Kim US
  • 실리콘을 함유한 폴리이미드-아미드의 합성 및 열적인 성질에 관한 연구
  • 윤구식, 성용길, 김은식
Abstract
N,N''- Bis(carboxyphenyl) - 3,3'',4,4''- benzophenonetetracarboxylic diimide(BCBTD) and bis(4-carboxyphenyl) diphenyl silane (BCDPS) were Polymerized with orthometa-, and para-phenylenediamines. The thermal stabilities of the copolymers were measured by using thermogravimetric analyzer (TCA). The polymers containing BCBTD were more thermally stable than the other copolymers. The polymers derived from the para- and meta-phenylenediamines were somewhat more heat-resistant compared with the products prepared from the ortho-phenylenediamine. The solubility of the polyimide-amide containing silicones has been also examined in the solvents such as N,N''-dimethylformamide(DMF), N-methyIpyrrolidone(NVP), dimethylsulfoxide(DMSO), and N,N''-dimethylacetamide(DMAC).

Keywords:

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1985; 9(5): 446-453

    Published online Oct 25, 1985

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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