Article
  • Adhesion Prorerties with Moisture Absorption between High Silica Loaded epoxy Molding Compound and Leadframe
  • Oh KK, Moon KS, Yoon HG, Moon TJ, Ryu JH, Kim JM, Kim JG
  • 실리카 고충전 에폭시 수지 조성물과 리드프레임과의 흡습에 따른 접착 특성
  • 오경근, 문경식, 윤호규, 문탁진, 유제홍, 김진모, 김조균
References
  • 1. Pecht MG, Nguyen LT, Hakim EBPlastic-Encapsulated Microelectronics, chap. 4, John Wiley & Sons, Inc., NY (1995)
  •  
  • 2. Nguyen LTSPE RETEC, 182 (1991)
  •  
  • 3. Kaji M, Takanori A, Kazuhiko N, J. Thermosetting Plast., 14, 1 (1993)
  •  
  • 4. Yoon HG, Moon KS, Kim JM, Polym. Abstr.(Korea), 22(1), 44 (1997)
  •  
  • 5. Pizzi A, Mittal KLHandbook of Adhesive Technology, Marcel Dekker, Inc., NY (1994)
  •  
  • 6. Nakazawa M, Somorjai GA, Appl. Surf. Sci., 84, 309 (1995)
  •  
  • 7. Comyn JDurability of Structural Adhesives, p. 85, Applied Science, Barking (1983)
  •  
  • 8. Gledhill RA, Kinloch AJ, Shaw SJ, J. Adhes., 11, 3 (1980)
  •  
  • 9. Gosselin CA, SAE Tech. Paper Ser.850211 (1985)
  •  
  • 10. Briggs DPractical Surface Analysis, Eds., by D. Briggs and M.P. Seah, John Wiely & Sons, Ltd., NY (1983)
  •  
  • 11. Spells SJCharacterization of Solid Polymers, Chapman & Hall, London (1994)
  •  
  • 12. Brundle CR, Chuang TJ, Wandelt K, Surf. Sci., 68, 459 (1977)
  •  
  • 13. Yoon HG, Moon TJAdhesion Mechanism between EMC and Leadframe and Development of Additives and Base Resin System for Good Adhesion Property of EMC, Final Research Report on Commision of Cheil Industries Inc. (1996)
  •  
  • 14. Evans URThe Corrosion and Oxidation of Metals, Edward Anold Ltd., London (1968)
  •  
  • 15. Stockbridge CD, Sewell PB, Cohen M, J. Electrochem. Soc., 108, 928 (1961)
  •  
  • 16. Glazer J, J. Polym. Sci., 98, 355 (1954)
  •  
  • 17. Andrews EH, King NK, J. Mater. Sci., 11, 2004 (1976)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1997; 21(5): 812-820

    Published online Sep 25, 1997

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

Correspondence to

  • E-mail: