Article
  • Influence of Activation Temperature on Surface Structure Changes and Adsorption Properties of PAN-based Carbon Fibers
  • Park SJ, Kim KD
  • PAN계 탄소섬유의 활성화 온도에 따른 표면구조의 변화 및 흡착 특성
  • 박수진, 김기동
References
  • 1. Donnet JB, Bansal RCCarbon Fibers, Marcel Dekker, New York (1990)
  •  
  • 2. Chan WC, Die Angew. Makro. Chem., 213, 3724 (1993)
  •  
  • 3. Park SJ, Donnet JB, J. Colloid Interface Sci., 200(1), 46 (1998)
  •  
  • 4. Suzuki M, Carbon, 32, 577 (1994)
  •  
  • 5. Ermolenko IN, Lyubliner IP, Gulko NVChemically Modified Carbon Fibers, VCH, Weinheim (1990)
  •  
  • 6. Dubinin MMProgress in Surface and Membrane Science, Academic Press, New York (1975)
  •  
  • 7. Park SJ, Brendle M, J. Colloid Interface Sci., 188(2), 336 (1997)
  •  
  • 8. Polovina M, Babic B, Kaluderovic B, Dekanski A, Carbon, 35, 1047 (1997)
  •  
  • 9. Biniak S, Szymanski G, Siedlewski J, Swiatkoeski A, Carbon, 35, 12 (1997)
  •  
  • 10. Barton SS, Evans MJB, Hallilop E, Macdonald JAF, Carbon, 35, 1361 (1997)
  •  
  • 11. Leng CC, Pinto NG, Carbon, 35, 1375 (1997)
  •  
  • 12. Jaroniec M, Madey RPhysical Adsorption on Heterogeneous Solids, Elsevier, Amsterdam (1988)
  •  
  • 13. Boehm HP, Heck W, Sappok R, Angew. Chem., 76, 742 (1964)
  •  
  • 14. Brunauer S, Emmett PH, Teller E, J. Am. Chem. Soc., 60, 309 (1938)
  •  
  • 15. Barrett EP, Joyner LG, Halenda PP, J. Am. Chem. Soc., 73, 373 (1951)
  •  
  • 16. Bansal RC, Donnet JB, Stoeckli FActive Carbon, Marcel Dekker, New York (1988)
  •  
  • 17. Leony Leon CA, Solar JM, Calemma V, Radovic LR, Carbon, 30, 797 (1993)
  •  
  • 18. Sing KSW, Everett DH, Haul RAW, Pure Appl. Chem., 57, 603 (1985)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1998; 22(6): 994-998

    Published online Nov 25, 1998

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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