Article
  • Thermal Properties and Fracture Toughness of Bisphenol-Based DGEBA/DGEBS Epoxy Blend System
  • Park SJ, Jin FL, Lee JR, Shin JS
  • Bisphenol계 DGEBA/DGEBS 에폭시 블렌드 시스템의 열적 특성 및 파괴인성
  • 박수진, 김범용, 이재락, 신재섭
References
  • 1. Bauer RSEpoxy Resin Chemistry, in Advanced in Chemistry Series, No. 114, American Chemical Society, Washington D.C. (1979)
  •  
  • 2. Lee H, Nevile KHandbook of Epoxy Resin, McGraw-Hill, New York (1967)
  •  
  • 3. Park SJ, Kim HC, Lee HI, Suh DH, Macromolecules, 34(22), 7573 (2001)
  •  
  • 4. Park SJ, Kim TJ, Kim HY, Polym. Int., 51, 386 (2002)
  •  
  • 5. Lin MS, Wang MW, Polym. Int., 48, 1243 (1999)
  •  
  • 6. Lin MS, Chiu CC, J. Appl. Polym. Sci., 80(7), 963 (2001)
  •  
  • 7. Chakrabarty D, Das B, Roy S, J. Appl. Polym. Sci., 67(6), 1051 (1998)
  •  
  • 8. Sykora V, Spacek V, Dobas I, J. Appl. Polym. Sci., 54(10), 1463 (1994)
  •  
  • 9. Gao JG, Li YF, Polym. Int., 49, 1590 (2000)
  •  
  • 10. Parekh JK, Patel RG, Angew. Makromol. Chem., 227, 1 (1995)
  •  
  • 11. Park SJ, Kim HC, J. Polym. Sci. B: Polym. Phys., 39(1), 121 (2001)
  •  
  • 12. Stevens MPPolymer Chemistry, Oxford University Press, New York (1999)
  •  
  • 13. Pielichowski K, Czub P, Pielichowski J, J. Appl. Polym. Sci., 69(3), 451 (1998)
  •  
  • 14. Kakiuchi HRecent Development of Epoxy Resin Hardener, CMC, Tokyo (1994)
  •  
  • 15. Shen SG, Li YF, Gao JG, Sun HW, Int. J. Chem. Kinet., 33, 558 (2001)
  •  
  • 16. Ozawa T, Bull. Chem. Soc. Jpn., 38, 1881 (1965)
  •  
  • 17. Park SJ, Kim TJ, Lee JR, J. Polym. Sci. B: Polym. Phys., 38(16), 2114 (2000)
  •  
  • 18. Winter HH, Polym. Eng. Sci., 27, 1698 (1987)
  •  
  • 19. Waters DN, Paddy JL, Anal. Chem., 60, 53 (1988)
  •  
  • 20. Doyle CD, Anal. Chem., 33, 77 (1961)
  •  
  • 21. Kwak GH, Park SJ, Lee JR, J. Appl. Polym. Sci., 78(2), 290 (2000)
  •  
  • 22. Lu MG, Shim MJ, Kim SW, Polym. Int., 48, 787 (1999)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2003; 27(1): 33-39

    Published online Jan 25, 2003

  • 10.7317/pk.
  • Received on Aug 30, 2002
  • Revised on Nov 30, -0001
  • Accepted on Oct 9, 2002

Correspondence to

  • E-mail: