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References
  • 1. Zhang JY, Windall G, Boyd IW, Appl. Surf. Sci., 186, 568 (2002)
  •  
  • 2. Bemporad E, Carassiti F, Tara A, Gallinaro G, Paris M, Radiat. Phys. Chem., 57, 393 (2000)
  •  
  • 3. Wang X, Chung DDL, Cem. Conc. Res., 26, 1007 (1996)
  •  
  • 4. Park JM, Lee SI, Kim KW, Yoon DJ, J. Colloid Interface Sci., 237(1), 80 (2001)
  •  
  • 5. Lee S, Springer GS, J. Compos. Mater., 22, 15 (1998)
  •  
  • 6. Wang X, Chung DDL, Compos. Interfaces, 5(3), 277 (1998)
  •  
  • 7. Feng JY, Chan CM, Polymer, 41(19), 7279 (2000)
  •  
  • 8. Wang S, Lee SI, Chung DDL, Park JM, Compos. Interfaces, 8(6), 435 (2001)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2003; 27(3): 189-194

    Published online May 25, 2003

  • 10.7317/pk.
  • Received on Feb 11, 2003
  • Revised on Nov 30, -0001
  • Accepted on Mar 18, 2003

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