Article
  • Preparation and Properties of Cellulose Diacetate/CaCO3 Composite
  • Lim H, Kye H, Won S, Nam JD, Lee Y
  • Cellulose Diacetate/CaCO3 복합체의 제조 및 물성
  • 임환규, 계형산, 원성호, 남재도, 이영관
References
  • 1. Kester JJ, Fennema OR, Food Technol., 40, 47 (1986)
  •  
  • 2. Kim YJ, Shin CH, Lee SI, Jang SH, Kim BS, Shin BY, J. Korean Ind. Eng. Chem., 11(3), 276 (2000)
  •  
  • 3. Mwaikambo LY, Ansell MP, Angew. Makromol. Chem., 272, 108 (1999)
  •  
  • 4. Lu X, Zhang MQ, Rong MZ, Shi G, Yang GC, Zeng HM, Adv. Compos. Lett., 8, 231 (1999)
  •  
  • 5. Hon DNS, Josefina MSL, J. Polym. Sci. A: Polym. Chem., 27, 4143 (1989)
  •  
  • 6. Hon DNS, Ou NJ, J. Polym. Sci. A: Polym. Chem., 27, 2457 (1989)
  •  
  • 7. Lee SH, Lee SY, Nam JD, Lee Y, Polym.(Korea), 30(1), 70 (2006)
  •  
  • 8. Frohoff-Hulsmann MA, Lippold NC, McGinity KW, Euro. J. Pharma. Biopharma., 48, 67 (1999)
  •  
  • 9. Bechard SR, Levy L, Clas SD, Inter. J. Pharma., 114, 205 (1995)
  •  
  • 10. Sumita M, Shizuma T, Miyasaka K, Ishikawa K, J. Macromol. Sci.-Phys., 22, 601 (1983)
  •  
  • 11. Sumita M, Tsukurmo T, Miyasaka K, Ishikawa K, J. Mater. Sci., 18, 1758 (1983)
  •  
  • 12. Bala H, Fu W, Zhao J, Ding X, Jing Y, Yu K, Wang Z, Colloids Surf., 252, 129 (2005)
  •  
  • 13. Jia ZQ, Liu ZZ, J. Membr. Sci., 209(1), 153 (2002)
  •  
  • 14. Hyppola R, Husson I, Sundholm F, Int. J. Pharm., 133, 161 (1996)
  •  
  • 15. Lee S, Lee S, Lim H, Kye H, Lee Y, Polym.(Korea), 30(6), 532 (2006)
  •  
  • 16. Law PW, Longdon A, Willins GG, Marcromol. Symp., 208, 293 (2004)
  •  
  • 17. Xiong Y, Chen GS, Guo SY, J. Appl. Polym. Sci., 102(2), 1084 (2006)
  •  
  • 18. Lazzeri A, Thio YS, Cohen RE, J. Appl. Polym. Sci., 91(2), 925 (2004)
  •  
  • 19. Chen CH, Teng CC, Su SF, Wu WC, Yang CH, J. Polym. Sci. B: Polym. Phys., 44(2), 451 (2006)
  •  
  • 20. Wang H, Sun X, Seib P, J. Appl. Polym. Sci., 84, 1259 (2002)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2008; 32(2): 178-182

    Published online Mar 25, 2008

  • 10.7317/pk.
  • Received on Dec 28, 2007
  • Revised on Nov 30, -0001
  • Accepted on Feb 10, 2008

Correspondence to

  • E-mail: