Article
  • A Novel Runner Design for Flow Balance of Cavities in Multi-Cavity Injection Molding
  • Park SR, Kim JH, Lyu MY
  • 다수 빼기 사출성형에서 캐비티간 충전균형을 위한 새로운 런너의 설계
  • 박서리, 김지현, 류민영
References
  • 1. Osswald TA, Turng LS, Gramann PJInjection Molding Handbook, Hanser, Munich (2001)
  •  
  • 2. Lyu MY, Kim HY, Polymer Science and Technology, 20, 157 (2009)
  •  
  • 3. Kang MA, Lyu MY, Polym.(Korea), 32(6), 501 (2008)
  •  
  • 4. Beaumont JP, Young JH, Jaworski MJ, ANTEC, 56, 599 (1998)
  •  
  • 5. Beaumont J, Ralston J, Shuttleworth A, ANTEC, 57, 461 (1999)
  •  
  • 6. Coulter J, Takarada K, Beaumont J, Myers M, ANTEC, 64, 1098 (2006)
  •  
  • 7. Paszkowski RT, Garnavish KE, ANTEC, 60, 3536 (2002)
  •  
  • 8. Cypher JA, Neely AM, ANTEC, 61, 3363 (2003)
  •  
  • 9. Chien CC, Chiang CC, Yang WH, Tsai V, Hsu DC, ANTEC, 63, 55 (2005)
  •  
  • 10. Kumar A, Egelja A, Grald EW, Beaumont JP, ANTEC, 60, 541 (2002)
  •  
  • 11. Auell P, Bailey M, ANTEC, 60, 3495 (2002)
  •  
  • 12. Hoover J, McKee R, Society of Plastics Engineers, 2868 (2006)
  •  
  • 13. Cook PS, You H, Kietzmann CV, Costa FS, ANTEC, 63, 526 (2005)
  •  
  • 14. Casaldi HE, Michel T, ANTEC, 59, 3112 (2001)
  •  
  • 15. Beaumont JP, ANTEC, 69, 3680 (2001)
  •  
  • 16. Boell K, Beaumont JP, Young B, ANTEC, 61, 430 (2003)
  •  
  • 17. Beaumont JP, Ralston J, ANTEC, 57, 77 (1999)
  •  
  • 18. Park HP, Cha BS, Rhee BO, Transactions of Materials Processing, 15, 47 (2006)
  •  
  • 19. Kang CM, Jeong YD, Han KT, Transactions of Materials Processing, 15, 42 (2006)
  •  
  • 20. Beaumont JPUS Patent 6,077,470 (2000)
  •  
  • 21. Beaumont JP, US Patent 6,503,438 (2003)
  •  
  • 22. Wiechard CA, US Patent 4,620,958 (2003)
  •  
  • 23. Katsttoshi N, Japan Patent 0020563 (1993)
  •  
  • 24. Kim HT, Jeon YR, Korea Patent 10-2006-0079007 (2006)
  •  
  • 25. Kim HT, Jeon YRKorea Patent 10-2006-0075199 (2006)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(6): 561-568

    Published online Nov 25, 2009

  • 10.7317/pk.
  • Received on May 29, 2009
  • Revised on Nov 30, -0001
  • Accepted on Jul 9, 2009

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