Article
  • Effect of Surface Modification Process Conditions on Properties of Aramid Paper
  • Sha L, Zhao H
  • 아라미드 종이의 특성에 대한 표면 개질 과정 조건의 영향
  • Sha L, Zhao H
References
  • 1. George CG, Waynesboro V, U.S.Patent 3,756,908 (1973)
  •  
  • 2. Bhatia A, Proc. of the Electrical/Electronics Insulation Conf., Illinois, USA (1995)
  •  
  • 3. Forsten HH, Khan S, U.S.Patent 6,312,561 (2001)
  •  
  • 4. Nomoto K, U.S.Patent 6,544,622 (2003)
  •  
  • 5. Yang W, Yu H, Zhu MF, J. Macromol. Sci. Phys., 45, 573 (2006)
  •  
  • 6. Jung H, Klein P, Kampschulte U, U.S.Patent 5,432,255 (1995)
  •  
  • 7. Ohba A, Yoshitomi T, Iwasaki H, Takine K, U.S.Patent 6,569,987 (2003)
  •  
  • 8. Merriman EA, TAPPI J., 67, 66 (1984)
  •  
  • 9. Homan B, Kinsley JR, U.S.Patent 2004/0140072A1 (2004)
  •  
  • 10. Park SJ, Seo MK, Polym.(Korea), 29(3), 221 (2005)
  •  
  • 11. Liu TM, Zheng YS, Hu J, J. Appl. Polym. Sci., 118(5), 2541 (2010)
  •  
  • 12. Peng T, Cai RQ, Chen CF, Wang FD, Liu XY, Wang B, Xu JJ, J. Macromol. Sci., Part B: Physics., 51, 538 (2012)
  •  
  • 13. Zhang MY, Yu JH, Lu ZQ, Trans. Chin. Pulp. Pap., 21, 72 (2006)
  •  
  • 14. Yan ZY, Shi HQ, Liu AH, Jia DM, J. Text. Res., 28, 19 (2007)
  •  
  • 15. Sim MK, Seul SD, Polym.(Korea), 32(5), 433 (2008)
  •  
  • 16. SHEU GS, SHYU SS, J. Adhes. Sci. Technol., 8(5), 531 (1994)
  •  
  • 17. Qiu J, Zhang ZQ, Synth. Fiber., 30, 25 (2001)
  •  
  • 18. Zhang YH, Huang YD, He JM, Wu LN, Xu ZW, Compos. Interfaces, 15(6), 611 (2008)
  •  
  • 19. Liu L, Zhang X, Huang YD, Zhang ZQ, J. Aeronautical Mater., 23, 49 (2003)
  •  
  • 20. Liu L, Zhang X, Huang YD, Jiang B, Zhang ZQ, Acta Materiae Compositae Sinica., 20, 35 (2003)
  •  
  • 21. Wang Y, Li P, Yu YH, Sui G, Yang XP, Acta Materiae Compositae Sinica., 24, 7 (2007)
  •  
  • 22. Kim JK, Kim JH, Seoul YG, Polym.(Korea), 18(5), 775 (1994)
  •  
  • 23. Yue CY, Padmanabhan K, Compos. Part B: Engineering., 30, 205 (1999)
  •  
  • 24. Lin JS, Eur. Polym. J., 38, 79 (2002)
  •  
  • 25. Mori M, Uyama Y, Ikada Y, Polymer, 35(24), 5336 (1994)
  •  
  • 26. Nie WZ, Li J, Zhou Z, Polym.-Plast. Technol. Eng., 49, 305 (2010)
  •  
  • 27. Shin SH, Jang JS, Kim EY, Kim HD, Polym.(Korea), 20(1), 134 (1996)
  •  
  • 28. Kim JG, Choi I, Lee DG, Seo IS, Compos. Struct., 93, 2696 (2011)
  •  
  • 29. Tappi Standard, T494 om-01. Tensile Properties of Paper and Paperboard (Using Constant Rate of Elongation Apparatus), USA (2001)
  •  
  • 30. Zhao HF, Zhang MY, Zhang SF, Lu JB, Polym. -Plast. Technol. Eng., 51, 134 (2012)
  •  
  • 31. Lin TK, Wu SJ, Lai JG, Shyu SS, Compos. Sci. Technol., 60, 1873 (2000)
  •  
  • 32. Ramazan B, Tesoro CG, Tex. Res. J., 60, 334 (1990)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2013; 37(2): 196-203

    Published online Mar 25, 2013

  • 10.7317/pk.
  • Received on Oct 24, 2012
  • Revised on Nov 30, -0001
  • Accepted on Jan 23, 2013

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