Article
  • Development and Characterization of Low-Dielectric Polyimide-Based Material with Low-Temperature Curing for High-Frequency Electronic Components

  • Young Bin Cho, Kyungsun Kim, Se-Hoon Park, Yunsik Park, and Hyun Jin Nam†

  • ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea

  • 고주파 소자용 저온 경화형 Polyimide 기반 저유전 소재 개발 및 특성 연구

  • 조영빈 · 김경선 · 박세훈 · 박윤식 · 남현진†

  • 한국전자기술연구원 ICT디바이스패키징연구센터

  • Reproduction, stored in a retrieval system, or transmitted in any form of any part of this publication is permitted only by written permission from the Polymer Society of Korea.

References
  • 1. Tao, K.; Qin, F.; Li, Y.; Zhang, S.; Han, S.; Liu, G.; Wang, J.; Shen, J.; Yang, Z.; Tang, Y.; Sun, G. Fabrication, Mechanical and Electrical Properties of Polyimide Films Cured at Low-temperature Assisted by Microwave Radiation. High Perform. Polym. 2022, 34, 998-1008.
  •  
  • 2. Zhang, P.; Huang, H.; Wang, S. Research and Manufacture of Thermoplastic Polyimide Engineering Plastics. Adv. Mat. Res. 2012, 550, 877-881.
  •  
  • 3. Yokota, R.; Horiuchi, R.; Kochi, M.; Soma, H.; Mita, I. High-strength and High Modulus Aromatic Polyimide Polyimide Molecular Composite Films. J. Polym. Sci. Part C-Polym. Lett., 1988, 26, 215-223.
  •  
  • 4. Zhou, J.; Sun, K.; Huang, S.; He, X.; Cai, W.; Zhao, Y.; Li, W. Facile Fabrication of Polyimide-alumina Composite Coatings by Liquid Flame Spray. Coatings 2020, 10, 857.
  •  
  • 5. Huang, T.; Hsieh, C.; Yeh, T.; Lai, C.; Tsai, M.; Yeh, J. Comparative Studies on Corrosion Protection Properties of Polyimide-silica and Polyimide-clay Composite Materials. J. Appl. Polym. Sci., 2011, 119, 548-557.
  •  
  • 6. Hu, K.; Ye, Q.; Fan, Y.; Nan, J.; Chen, F.; Gao, Y.; Shen, Y. Preparation and Characterization of Organic Soluble Polyimides with Low Dielectric Constant Containing Trifluoromethyl for Optoelectronic Application. Eur. Polym. J., 2021, 157, 110506.
  •  
  • 7. Mitsui, H.; Shiono, T.; Ushiki, M.; Sato, Y.; Sudo, S.; Ono, S.; Murase, T. Electrical and Mechanical Properties of Thermoplastic Polyimide-insulated Coaxial Cable for Use Under High-temperature and Radioactive Conditions. Electr. Eng. Jpn., 1995, 115, 12-21.
  •  
  • 8. Yuan, H.; Lu, C.; Zhang, S.; Wu, G. Preparation and Characterization of a Polyimide Coating on the Surface of Carbon Fibers. N. Carbon Mater., 2015, 30, 115-121.
  •  
  • 9. Iwata, M.; Ohnishi, A.; Hirosawa, H.; Tohyama, F. Measurement and Evaluation of Thermal Control Material with Polyimide for Space Use. J. Spacecr. Rockets 2001, 38, 504-509.
  •  
  • 10. Li, M.; Gong, C.; He, J. Application and Research Progress of Polyimide in the Field of Microelectronics. Adv. Mater. Ind., 2018, 2, 46-51.
  •  
  • 11. Gouzman, I.; Grossman, E.; Verker, R.; Atar, N.; Bolker, A.; Eliaz, N. Advances in Polyimide-based Materials for Space Applications. Adv. Mater., 2019, 31, 1807738.
  •  
  • 12. Ji, D.; Li, T.; Hu, W.; Fuchs, H. Recent Progress in Aromatic Polyimide Dielectrics for Organic Electronic Devices and Circuits. Adv. Mater., 2019, 31, 1806070.
  •  
  • 13. Ma, P.; Dai, C.; Wang, H.; Li, Z.; Liu, H.; Li, W.; Yang, C. A Review on High Temperature Resistant Polyimide Films: Heterocyclic Structures and Nanocomposites. Compos. Commun., 2019, 16, 84-93.
  •  
  • 14. Li, Y.; Sun, G.; Zhou, Y.; Liu, G.; Wang, J.; Han, S. Progress in Low Dielectric Polyimide Film–A Review. Prog. Org. Coat., 2022, 172, 107103.
  •  
  • 15. Wang, Y.; Huang, X.; Li, T.; Li, L.; Guo, X.; Jiang, P. Polymer-based Gate Dielectrics for Organic Field-effect Transistors. Chem. Mater., 2019, 31, 2212-2240.
  •  
  • 16. Peng, X., Xu, W., Chen, L., Ding, Y., Chen, S.; Wang, X.; Hou, H. Polyimide Complexes with High Dielectric Performance: Toward Polymer Film Capacitor Applications. J. Mater. Chem. C 2016, 4, 6452-6456.
  •  
  • 17. Nishikawa, M.; Suganuma, T.; Tsuda, Y.; Bessho, N.; Iimura, Y.; Kobayashi, S. Properties of Voltage Holding Ratios of Liquid-crystal Cells Using Organic-solvent-soluble Polyimide Alignment Films. Japan. J. Appl. Phys. Part 2-Lett., 1994, 33, L1113-L1116.
  •  
  • 18. Hirosawa, I. Method of Characterizing Rubbed Polyimide Film for Liquid Crystal Display Devices Using Reflection Ellipsometry. Japan. J. Appl. Phys. Part 1-Regul. Pap. Short Notes Rev. Pap., 1996, 35, 5873-5875.
  •  
  • 19. Al-Samman, A. M.; Rahman, T. A.; Azmi, M. H.; Al-Gailani, S. A. Millimeter-wave Propagation Measurements and Models at 28 GHz and 38 GHz in a Dining Room for 5G Wireless Networks. Measurement, 2018, 130, 71-81.
  •  
  • 20. Dietz, M.; Bauch, A.; Aufinger, K.; Weigel, R.; Hagelauer, A. A 1 to 32 GHz Broadband Multi-octave Receiver for Monolithic Integrated Vector Network Analyzers in SiGe Technology. Int. J. Microw. Wirel. Technol., 2018, 10, 717-728.
  •  
  • 21. Luo, J.; He, J.; Wang, H.; Chang, S.; Huang, Q.; Yu, X. P. A 28 GHz LNA Using Defected Ground Structure for 5G Application. Microw. Opt. Technol. Lett., 2018, 60, 1067-1072.
  •  
  • 22. Kim, S.; Park, Y.; Kim, S. The Influence of Magnetic and Dielectric Loss on the Noise Absorption of Iron Particles-rubber Composites Attached to a Microstrip Line. Met. Mater. Int. 2008, 14, 233-237.
  •  
  • 23. Alshabo, A.; Stirling, D.; Ros, M.; Vial, P. J.; Wysocki, B.; Wysocki, T. An Approach to Ultra-Wideband Channel Calibration using a Vector Network Analyser, Aust. J. Electr. Electron. 2014, 11, 347-356.
  •  
  • 24. Brandhofer, T.; Gini, A.; Stockerl, S.; Piekarski, D.; García Mancheño, O. Direct C–H Bond Imidation with Benzoyl Peroxide as a Mild Oxidant and a Reagent. J. Org. Chem., 2019, 84, 12992-13002.
  •  
  • 25. Song, J.; Park, S.; Nam, H.;, Naqi, M. Chip-embedded Antenna-in-package Module Using Modified Polyimide (MPI) Low-loss Materials for Millimeter-wave Application. AIP Adv., 2023, 13, 055119.
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2024; 48(4): 395-402

    Published online Jul 25, 2024

  • 10.7317/pk.2024.48.4.395
  • Received on Feb 29, 2024
  • Revised on Apr 17, 2024
  • Accepted on Apr 17, 2024

Correspondence to

  • Hyun Jin Nam

  • ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Korea

  • E-mail: hjnam1203@keti.re.kr