Moses Gu, Hwangbo Yuhwan, Seonwoo Kim*, Yubin Kim*, Se-Hoon Park*, Sung-Hoon Choa† , and Hyun Jin Nam*,†
Department of Semiconductor Engineering, Seoul National University of Science and Technology, Gongneung-ro 232, Nowon-gu, Seoul 01811, Korea
*ICT device Packaging Research Center, Korea Electronics Technology Institute (KETI), 25, Saenari-ro, Bundang-gu, Seongnam-si, Gyeonggi-do 13509, Korea
서울과학기술대학교 일반대학원 지능형반도체공학과
*한국전자기술연구원 ICT디바이스패키징연구센터
Reproduction, stored in a retrieval system, or transmitted in any form of any part of this publication is permitted only by written permission from the Polymer Society of Korea.
2024; 48(6): 630-638
Published online Nov 25, 2024
Department of Semiconductor Engineering, Seoul National University of Science and Technology, Gongneung-ro 232, Nowon-gu, Seoul 01811, Korea
*ICT device Packaging Research Center, Korea Electronics Technology Institute (KETI), 25, Saenari-ro, Bundang-gu, Seongnam-si, Gyeonggi-do 13509, Korea