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References
  • 1. Hollahan JRTechniques and Application of Plasma Chemistry, Wiley Intersci. Pub., New York (1974)
  •  
  • 2. Morita S, Shen M, J. Polym. Sci. B: Polym. Phys., 15, 981 (1977)
  •  
  • 3. Davies DH, Miller RH, Maki S199th Proceedings of the ACS Division of Polymeric Materials: Science and Engineering, Vol. 62, Boston, U.S.A., Spring (1990)
  •  
  • 4. U.K. Patent, 84-160504
  •  
  • 5. Japan Patent, 85-51505
  •  
  • 6. Japan Patent, 84-160504
  •  
  • 7. Japan Patent, 82-91708
  •  
  • 8. Colter KD, Shen M, Bell AT, Biomat. Med. Dev. Art. Org., 5, 13 (1977)
  •  
  • 9. Havens MR, Biolsi ME, Mayhan KG, J. Vac. Sci. Technol., 13, 575 (1976)
  •  
  • 10. Yasuda HPlasma Polymerization, Acad, Press, New York (1985)
  •  
  • 11. Yasuda H, Wang CR, J. Polym. Sci. A: Polym. Chem., 23, 87 (1985)
  •  
  • 12. Park SYPh.D. Thesis, Seoul National University (1988)
  •  
  • 13. Park SY, Kim N, Kim UY, Hong SI, Sasabe H, Polym. J., 22, 242 (1990)
  •  
  • 14. Park SY, Kim N199th Proceedings of the ACS Division of Polymeric Materials : Science and Engineering, Vol. 62, Boston, U.S.A., Spring (1990)
  •  
  • 15. Wrobel AM, Klemberg JE, Wertheimer MR, Schreiber HP, J. Macromol. Sci.-Chem., A15, 197 (1981)
  •  
  • 16. Ohkubo J, Inagaki N, Polym. Bull., 23, 199 (1990)
  •  
  • 17. Owens DK, Wendt RC, J. Polym. Sci., 13, 1741 (1969)
  •  
  • 18. Krishnamurthy V, Kamel IL, J. Appl. Polym. Sci., 38, 605 (1989)
  •  
  • 19. Wrobel AM, J. Macromol. Sci.-Chem., A22, 1089 (1985)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1991; 15(1): 88-94

    Published online Feb 25, 1991

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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