Article
  • Synthesis and Adhesive Characteristics of Aromatic Copolyamides
  • Lee KB, Kim YK
  • 방향족 및 지방족계 Copolyamide의 합성과 접착력 연구
  • 이광복, 김양국
Abstract
Aromatic-aliphatic random copolyamides were synthesized by using solution polymerization for the adhesive application. Various mole ratios of diisocyanates versus carboxylic acids were employed to investigate the stoichiometric effect on polymerization behaviour such as molecular weight distribution, viscosity changes. Glass transition temperatures of copolyamides from combinations of aromatic and aliphatic compoundes were in the range of 118℃-167℃ and relationship between Tg and adhesive strength was described. Adhesive effect of physical force and cross-linking resulted from molecular entanglement and chemical reaction, respectively, on hot-melt polyamides were discussed.

지방족 및 방향족계 단량체로 부터 접착력을 지닌 copolyamides를 용액중합에 의해 합성하였다. 각기 다른 isocyanate/carboxylic acid 몰비를 가진 단량체 혼합물로부터 반응조건에 따른 polyamides의 중합 행태를 비교 분석 하였다. 중합체의 Tg를 비롯한 물리적 성질을 조사하기 위해 지방족과 방향족계 단량체의 혼합몰비를 달리하여 공중합을 행하였으며 아울러 접착력과 분자량과의 상관관계를 나타내었다. 분자사슬의 entanglement에 의한 물리적 효과와 열처리 단계에서 화학반응에 의한 가교결합이 융착형 polyamides의 접착력에 미치는 영향이 논의 되었다.

References
  • 1. Seki M, Sato MU.S. Patent, 4,129,678 (1978)
  •  
  • 2. Suzuki K, Hayash Y, Nagamine SU.S. Patent, 4,031,287 (1977)
  •  
  • 3. Bayer O, Angew. Chem.-Int. Edit., 59, 257 (1947)
  •  
  • 4. Morgan PWCondensation Polymers by Interfacial and Solution Method, Wiley, New York (1965)
  •  
  • 5. Otsuki T, Kakimoto MA, Imai Y, J. Polym. Sci. A: Polym. Chem., 26, 2263 (1988)
  •  
  • 6. Bur AT, Fetters LJ, Chem. Rev., 76, 727 (1976)
  •  
  • 7. Korshak VV, Pankratov VA, Ladovskaya AA, Vinogradova SV, J. Polym. Sci. Polym. Ed., 16, 1967 (1978)
  •  
  • 8. Kim YK, Son HJGold Star Cable Co. Technical Report, Vol. 3 (1987)
  •  
  • 9. Bolon DAU.S. Patent, 4,388,371 (1983)
  •  
  • 10. Hoessel P, Schupp H, Lienert K, Lehmann HU.S. Patent, 5,059,660 (1991)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1994; 18(4): 552-558

    Published online Jul 25, 1994