Article
  • Synthesis of Sulfonated Hollow PP-g-Styrene Fibrous Ion-exchange Membrane and Separation of BSA Protein
  • Hwang TS, Lee JH
  • 술폰화 PP-g-Styrene 중공사 이온교환막의 합성과 BSA 단백질 분리에 관한 연구
  • 황택성, 이진혁
Abstract
A sulfonated PP-g-styrene ion-exchange hollow fiber membrane was prepared by pre-irradiation method with E-beam followed by sulfonation reaction. Degree of grafting increased with the increase of styrene monomer concentration and showed the maximum value of 128% at 80% of styrene monomer composition. Sulfonation yield increased with the degree of grafting. At 100% degree of grafting, sulfonation yield showed the maximum value of 13.4%. Ion exchange capacity of sulfonated HPP-g-styrene of 3.42 meq/g was attained, resulting in the remarkable increase of adsorption ability. BET analysis proved that the surface area of sulfonated HPP-g-styrene was 62.54 m(2)/g and the mean pore size was 25Å. From the BSA adsorption experiments, the adsorption amount of BSA was increased with sulfonation. At 13.4% sulfonation yield the adsorption amount of BSA was maximum as 3.8 mg/g. Sulfonated HPP-g-styrene was synthesized successfully and suitable for the adsorption and separation of BSA.

E-beam 전조사법을 이용하여 HPP-g-styrene 공중합체와 술폰화 반응을 통한 술폰화 HPP-g-styrene 섬유이온교환체를 합성하였다. 그라프트율은 스티렌 단량체 농도가 증가함에 따라 증가하였으며 스티렌 단량체 농도가 80%에서 그라프트율이 128%로 최대를 나타냈다. 술폰화율은 그라프트율이 증가함에 따라 증가하는 경향을 나타내었으며, 그라프트율이 100%일 때 13.4%로 최대값을 나타내었다. 술폰화 HPP-g-styrene 섬유이온교환체의 이온교환용량은 약 3.42 meq/g 으로써 흡착 성능이 매우 우수한 소재임을 확인하였다. BET 분석결과 술폰화 HPP-g-styrene의 비표면적은 62.54 m(2)/g, 기공크기는 25 Å으로 반응전보다 비표면적은 감소하였고 기공크기는 약간 증가하는 경향을 보였다. 또한 Bovine Serum Albumin (BSA) 흡착 실험 결과 술폰화도가 증가함에 따라 BSA 흡착 용량이 증가하는 경향을 나타내었으며, 술폰화도 13.4%에서 BSA 흡착용량 3.8 mg/g으로 최대를 나타내었다. 따라서 본 연구에서 합성한 섬유이온교환체가 BSA 흡착·분리에 적합한 소재임을 확인하였다.

Keywords: hollow fiber; E-beam; pre-irradiation; graft polymerization; sulfonation; BSA

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2002; 26(4): 415-421

    Published online Jul 25, 2002

  • Received on Dec 12, 2001
  • Accepted on Apr 3, 2002