Article
  • Preparation of Silver/Polystyrene Beads via in Sito Reduction of Silver Alkylcarbamate Complex
  • Lim TH, Jeon YM, Gong MS
  • 은 알킬카바메이트 복합체의 환원에 의한 은/폴리스티렌 비드의 제조
  • 임태호, 전영민, 공명선
Abstract
Monodisperse polystyrene and its copolymer beads containing amine function were prepared for the electroless silver plating using reduction of silver alkylcarbamate complex in organic solvent. Soap-free emulsion polymerization was adopted for the polymerization of styrene, divinylbenzene(DVB), and 2-(N,N-dimethylamino)ethyl methacrylate (DAEMA) in the presence of poly(vinyl alcohol) in a water/methanol solvent. The resulting poly(styrene/DVB/DAEMA), containing 30/0∼1.5/0∼3 wt% in monomer composition, were found to be a sphere-type particle with diameter of 1 μm. Silver Agcoated polystyrene beads were prepared by in sito reduction of a silver 2-ethylhexylcarbamate (Ag-EHCB) complex solution with hydrazine without pretreatment of polystyrene beads. Robust Ag/polystyrene beads were analyzed by SEM, UV-visible spectrometer and XRD.

은 카바메이트 착체 화합물의 환원에 의한 무전해 도금법으로 은/폴리스티렌 비드를 제조하기 위하여 폴리스티렌 및 아민 관능기를 가지는 공중합체 비드를 제조하였다. 스티렌, divinylbenzene(DVB) 그리고 2-(N,N-dimethylamino) ethyl methacrylate(DAEMA) 단량체들을 poly(vinyl alcohol) 존재 하에서 물/메탄올을 용매로 사용하여 무유화중합을 진행하였다. 30/0∼1.5/0∼3 wt%의 단량체 조성을 가지는 poly(styrene/DVB/DAEMA) 비드는 구형으로 1 μm의 일정한 크기를 가지고 있었다. 아민 기능기를 가지는 폴리스티렌 비드의 무전해 도금은 비드의 전처리 없이 silver 2-ethylhexylcarbamate(Ag-EHCB) 복합체와 히드라진 환원제를 사용하여 메탄올 용액에서 진행하였다. 제조된 비드와 도금된 비드 표면의 형태를 SEM으로 관찰하였으며 은 도금된 비드를 분산시켜 자외선 흡수 변화 그리고 도금된 은의 성분을 XRD로 분석하였다.

Keywords: polystyrene bead; silver; silver alkylcarbamate complex; electroless plating.

References
  • 1. Hajdu JB, Plat. Surf. Finish., 83, 29 (1996)
  •  
  • 2. Hidber PC, Helbig W, Kim E, Whitesides GM, Langmuir, 12(5), 1375 (1996)
  •  
  • 3. Kim DO, Jin JH, Shon WI, Oh SH, Polym.(Korea), 31(5), 410 (2007)
  •  
  • 4. Kim DO, Shon WI, Jin JH, Oh SH, Polym.(Korea), 31(3), 184 (2007)
  •  
  • 5. Park HK, Yoon JK, Kim K, Langmuir, 22(4), 1626 (2006)
  •  
  • 6. Kim K, Lee HB, Park HK, Shin KS, J. Colloid Interf. Sci., 318, 195 (2008)
  •  
  • 7. Tian ZQ, Ren B, Wu DY, J. Phys. Chem. B, 106(37), 9463 (2002)
  •  
  • 8. Doering WE, Nie SM, J. Phys. Chem. B, 106(2), 311 (2002)
  •  
  • 9. Chu W, LeBlanc RJ, Williams CT, Kubota J, Zaera F, J. Phys. Chem. B, 107(51), 14365 (2003)
  •  
  • 10. Lala NL, Deivaraj TC, Lee JY, Colloid Surface A, 269, 119 (2005)
  •  
  • 11. Hou ZZ, Dante S, Abbott NL, Stroeve P, Langmuir, 15(8), 3011 (1999)
  •  
  • 12. Hidber PC, Nealey PF, Helbig W, Whitesides GM, Langmuir, 12(21), 5209 (1996)
  •  
  • 13. Brown KR, Natan MJ, Langmuir, 14(4), 726 (1998)
  •  
  • 14. van de Putten AMT, de Bakker JWG, Fokkink LGJ, J. Electrochem. Soc., 139, 3475 (1992)
  •  
  • 15. Menon VP, Martin CR, Anal. Chem., 67, 1920 (1995)
  •  
  • 16. Hrapovic S, Liu YL, Enright G, Bensebaa F, Luong JHT, Langmuir, 19(9), 3958 (2003)
  •  
  • 17. Gittins DI, Susha AS, Schoeler B, Caruso F, Adv. Mater., 14(7), 508 (2002)
  •  
  • 18. Siiman O, Burshteyn A, J. Phys. Chem. B, 104(42), 9795 (2000)
  •  
  • 19. Jun BH, Kim JH, Park H, Kim JS, Yu KN, Lee SM, Choi H, Kwak SY, Kim YK, Jeong DH, Cho MJ, Lee YS, J. Comb. Chem., 9, 237 (2007)
  •  
  • 20. Lee JM, Lee YG, Kim DW, Oh C, Koo SM, Oh SG, Colloid Surface A, 301, 48 (2007)
  •  
  • 21. Xu X, Luo X, Zhuang H, Li W, Zhang B, Mater. Lett., 57, 3987 (2003)
  •  
  • 22. Dearden AL, Smith PJ, Shin DY, Reis N, Derby B, O'Brien P, Macromol. Rapid Commun., 26(4), 315 (2005)
  •  
  • 23. Park MS, Lim TH, Jeon YM, Kim JG, Gong MS, Joo SW, Macromol. Res., 16(4), 308 (2008)
  •  
  • 24. Park MS, Lim TH, Jeon YM, Kim JG, Joo SW, Gong MS, Sens. Actuators B, 133, 166 (2008)
  •  
  • 25. Park MS, Lim TH, Jeon YM, Kim JG, Joo SW, Gong MS, J. Colloid Interf. Sci., 321, 60 (2008)
  •  
  • 26. Alessio R, Dell'Amico DB, Calderazzo F, Englert U, Guarini A, Labella L, Strasser P, Helv. Chim. Acta, 18, 219 (1998)
  •  
  • 27. Dell'Amico DB, Calderazzo F, Labella L, Marchetti F, Pampaloni G, Chem. Rev., 103(10), 3857 (2003)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(1): 33-38

    Published online Jan 25, 2009

  • Received on Jul 28, 2008
  • Accepted on Oct 13, 2008