Article
  • Liquid Crystalline Thermoset Films Based on Wholly Aromatic Copolymers
  • Moon HG, Ahn YH, Chang JH
  • 전방향족 공중합체의 열경화성 액정필름
  • 문현곤, 안용호, 장진해
Abstract
We used melt polymerization method to prepare a series of aromatic liquid crystals (LCs) based on aromatic ester and amide units with the reactive methyl-maleimide end group, and then the resulting thermally cross-linked LCs to produce LC thermoset films by means of solution casting and the followed heat treatment. The synthesized LCs and LCTs were characterized by Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), thermomechanical analysis (TMA), X-ray diffractometry (XRD), and polarizing optical microscopy (POM) with a hot stage. All of the LCs prepared by melt polymerization method formed smectic mesophases. The thermal properties of the LC and LCT films were strongly affected by the mesogen units in the main chain structures. The thermal expansion coefficients of samples were in the range of 27.72∼50.95 ppm/℃.

용융 중합법을 이용하여 말단에 메틸 말레이미드(methyl maleimide) 반응성기를 가지며 방향족 에스터와 아미드 결합을 포함하는 액정(liquid crystal, LC)을 합성하였다. 합성된 액정은 용액 캐스팅과 열처리를 거쳐 열경화성 액정(liquid crystalline thermoset, LCT) 필름으로 제조되었다. 합성된 LC 및 LCT는 적외선 분광기(FTIR), 시차주사 열량계(DSC), 열중량 분석기(TGA), 열-기계 분석기(TMA), X-선 회절기(XRD) 및 가열판이 부착된 편광 현미경(POM) 등을 이용해서 각각 특성 분석을 하였다. 합성된 모든 액정은 스멕틱(smectic) 상을 보였으며 LC와 LCT들의 열적 성질은 주로 주사슬에 포함된 메소젠 구조에 영향을 받았다. 열팽창 계수(coefficients of thermal expansion, CTE)는 27.72∼50.95 ppm/℃ 사이의 값을 보였다.

Keywords: liquid crystal; liquid crystalline thermoset; thermal property; coefficient of thermal expansion

References
  • 1. Wunder SL, Ramachandran S, Macromolecules, 19, 1969 (1986)
  •  
  • 2. Jackson Jr. WJ, Polym. J., 212, 154 (1980)
  •  
  • 3. Jin JI, Chang JH, Shim HK, Macromolecules, 19, 1969 (1986)
  •  
  • 4. Jin JI, Chang JH, Macromolecules, 22, 4402 (1989)
  •  
  • 5. Heitz T, Rohrbach P, Hocker H, Macromol. Chem., 190, 3295 (1985)
  •  
  • 6. Jin JI, Kang CS, Prog. Polym. Sci., 22, 937 (1997)
  •  
  • 7. Lincoln DM, Douglas EP, Polym. Eng. Sci., 39(10), 1903 (1999)
  •  
  • 8. Melissaris AP, Litt MH, Macromolecules, 27(10), 2675 (1994)
  •  
  • 9. Litt MH, Whang WT, Yen KT, Quin XJ, J. Polym. Sci. Part A: Polym. Chem., 31, 183 (1993)
  •  
  • 10. Hikmet RAM, Broer DJ, Polymer, 32, 1627 (1991)
  •  
  • 11. Langlois DA, Benicewicz BC, Douglas EP, Chem. Mater., 10, 3393 (1998)
  •  
  • 12. Gavrin AJ, Douglas EP, Macromolecules, 34(17), 5876 (2001)
  •  
  • 13. Carfagna C, Amendola E, Giamberini M, Compo. Struc., 27, 37 (1994)
  •  
  • 14. Rao BS, J. Polym. Sci. Part C: Polym. Lett., 26, 3 (1988)
  •  
  • 15. Hoyt AE, Benicewicz BC, J. Polym. Sci. Part A: Polym. Chem., 28, 3403 (1990)
  •  
  • 16. Hoyt AE, Benicewicz BC, J. Polym. Sci. Part A: Polym. Chem., 28, 3417 (1990)
  •  
  • 17. Korner H, Shiota A, Ober CK, Laus M, Chem. Mater., 9, 1588 (1997)
  •  
  • 18. Mormann W, Zimmermann JG, Macromolecules, 29(4), 1105 (1996)
  •  
  • 19. Wang ZD, Jiang SQ, Trans. Nonferrous Met. Soc. China, 16, 220 (2006)
  •  
  • 20. Masatoshi H, Azumi T, J. Photopolym. Sci. Tech., 18, 307 (2005)
  •  
  • 21. Masatoshi H, Yuma T, Kazunori K, Azumi T, J. Photopolym. Sci. Tech., 19, 285 (2006)
  •  
  • 22. Langlois DA, Benicewicz BC, Douglas EP, Chem. Mater., 6, 1925 (1994)
  •  
  • 23. Su WFA, J. Polym. Sci. Part A: Polym. Chem., 31, 3251 (1993)
  •  
  • 24. Shiota A, Ober CK, Prog. Polym. Sci., 22, 975 (1997)
  •  
  • 25. Gilli P, Bertolasi V, Ferretti V, Gilli G, J. Am. Chem. Soc., 122(42), 10405 (2000)
  •  
  • 26. Tien YI, Wei KH, Polymer, 42(7), 3213 (2001)
  •  
  • 27. Barclay GG, Ober CK, Prog. Polym. Sci., 18, 899 (1993)
  •  
  • 28. Ahn YH, Jung MS, Chang JH, Mater. Chem. Phys.in press.
  •  
  • 29. Gavrin AJ, Curts CL, Douglas EP, J. Polym. Sci. A: Polym. Chem., 37(22), 4184 (1999)
  •  
  • 30. Jin L, Agag T, Ishida H, Eur. Polym. J., 46, 354 (2010)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2010; 34(4): 369-375

    Published online Jul 25, 2010

  • Received on Mar 7, 2010
  • Accepted on Apr 13, 2010