Article
  • Effect of Diamine Composition on Thermo-Mechanical Properties and Moisture Absorption of Polyimide Films
  • Park YJ, Yu DM, Choi JH, Ahn JH, Hong YT
  • 디아민 변화에 따른 폴리이미드 필름의 물리적 특성과 흡습률 분석
  • 박윤준, 유덕만, 최종호, 안정호, 홍영택
Abstract
Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride (BPDA) and p-phenylenediamine (p-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4- component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

Pyromellitic dianhydride(PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride(BPDA) 그리고 pphenylenediamine(p-PDA)와 함께 1,4-bis(4-aminophenoxy)benzene(1,4-APB)와 2,2-bis[4-(4-aminophenoxy) phenyl]hexafluoropropane(HFBAPP)를 각각 이용하여 폴리아믹산을 합성하였고, 이를 열적 이미드화 공정을 통하여 폴리이미드 필름을 제조하였다. 제조된 필름은 퓨리에 변환 적외선 분광기(FTIR), 열 중량 분석기(TGA), 열 기계 분석기(TMA), 동·역학적 거동 분석기(DMA), 그리고 만능 인장 시험기(UTM) 등을 이용하여 화학 구조 및 열적·기계적 특성을 조사하였다. 1,4-APB와 HFBAPP의 조성이 증가함에 따라 열적·기계적 물성과 흡습률이 낮아지는 경향을 나타내었고, 동박과 비슷한 열팽창계수(CTE)를 가진 폴리이미드 필름의 경우 HFBAPP를 이용한 필름이 1,4-APB를 이용한 필름보다 향상된 열적 특성과 낮은 흡습률 결과를 나타내었다. 이와 같이 본 연구에서 합성된 폴리이미드 필름은 유연성 회로 기판의 flexible copper clad laminates(FCCL)를 위한 기본 필름으로 적용할 수 있을 것으로 판단된다.

Keywords: polyimide; monomer composition; coefficient of thermal expansion; moisture absorption.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2012; 36(3): 275-280

    Published online May 25, 2012

  • Received on Jul 21, 2011
  • Accepted on Nov 21, 2011