Article
  • Characterizations of Copoly(ester imide)s with New 2,7-Dihydroxynaphthalene Bis(trimellitate anhydride)
  • Ju J, Chang JH
  • 새로운 2,7-Dihydroxynaphthalene Bis(trimellitate anhydride) 무수물을 이용한 폴리(에스터 이미드) 공중합체의 특성
  • 주지은, 장진해
Abstract
2,7-Dihydroxynaphthalene bis(trimellitate anhydride) (2,7-TA) was synthesized from trimellitic anhydride chloride and 2,7-dihydroxynaphthalene. Copolyimides (Co-PI) containing ester group were synthesized from 2,7-TA, pxylylenediamine, and 2,2'-bis(trifluoromethyl)benzidine (TFB). The Co-PI films were obtained from poly(amic acid) by solution casting through thermal imidization on a glass plate. The thermal property, gas permeation, and optical transparency of the Co-PI films with various TFB monomer contents were investigated. These Co-PIs could be solution.cast into a flexible and tough film. The cast Co-PI films exhibited high optical transparency with a cut-off wavelength of 370~395 nm in UV-vis. absorption and a low yellow index value of 3.55~7.63. The thermal property of Co-PI films increased linearly with increasing TFB content. However, the oxygen permeation and optical transparency of the Co-PI films was found to worsen with increasing TFB content.

Trimellitic anhydride chloride와 2,7-dihydroxynaphthalene을 이용하여 2,7-dihydroxynaphthalene bis(trimellitate anhydride) (2,7-TA)의 무수물 단량체를 합성하였다. 합성된 2,7-TA와 p-xylylenediamine 및 2,2'-bis(trifluoromethyl) benzidine(TFB)을 다양한 몰 비로 반응하여 얻은 폴리아믹산(polyamic acid, PAA)을 유리판에서 열처리하여 에스터기를 가지는 폴리이미드 공중합체(copolyimide, Co-PI)를 합성하였다. 합성된 Co-PI는 TFB의 몰 비 조성에 따라 열적 성질, 가스 투과도, 및 광학 성질 등을 조사하였다. 용액 캐스팅으로 합성된 Co-PI 필름은 유연하고 질긴 성질을 보였다. Co-PI 필름은 모두 투명하였으며, 각 필름의 cut-off wavelength은 370~395 nm이었고, 노란색 지수는 3.55~7.63의 비교적 낮은 값을 보여주었다. Co-PI 필름의 열적 성질들은 TFB의 몰 비가 증가할수록 증가하였지만, 산소 차단성과 광학 투명성에서는 반대의 결과를 보여주었다.

Keywords: copolyimide; films; thermal property; gas permeation; optical transparency.

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2014; 38(5): 632-639

    Published online Sep 25, 2014

  • Received on Feb 14, 2014
  • Accepted on Apr 7, 2014