Article
  • Effect of Conductive Filler Shape on Fine Electrode Pattern of Photosensitive Silver Pastes
  • Lim HS, Choi H, Kim B, Park SD
  • 전도성 입자의 형태가 감광성 실버 페이스트의 미세 전극 패턴 형성에 미치는 영향
  • 임호선, 최학렬, 김범준, 박성대
Abstract
Photosensitive silver pastes were developed using a mixture of spherical and flake-type silver particles for fine electrode patterns with high electrical conductivity, and the electrical characteristics were evaluated as a function of particle shape. The photosensitive silver pastes mixed up novolac epoxy-modified acrylate oligomer, acrylate monomer, and photoinitiator as a photocurable and alkali-developable binder resin composition, and silver spheres and flakes as conductive fillers. With a increase of silver loading amount the volume resistance decreased due to enhancement of packing density between the conductive fillers, where the conductive paste with 88 wt% silver sphere content showed 1.14×10-4 Ω·cm. When the silver particles loading and sphere to flake ratio were 84 wt% and 8:2, the volume resistance exhibited 7.04×10-5 Ω·cm. This result was attributed to improvement of electrical contacts between silver spheres by flakes.

전도성이 우수한 미세 전극 패턴을 형성하기 위해 은 분말을 함유한 감광성 페이스트를 구현하고 입자의 형태에 따른 전기적 특성을 평가하였다. 노볼락 에폭시 변성 아크릴레이트 올리고머, 아크릴레이트 단량체, 광개시제를 혼합하여 광경화 및 알칼리 현상이 가능한 수지조성을 기반으로 은 분말을 첨가하여 감광성 Ag 페이스트를 제조하였다. 구형 은 분말의 함량이 증가할수록 전도성 입자간 밀집도가 좋아져 비저항(volume resistance) 값은 낮아졌으며, 88 wt%의 구형 은 분말을 함유한 페이스트는 1.14×10-4 Ω·cm의 값을 나타내었다. 구형과 판상형 은 분말을 8:2의 비로 혼합하였을 때 84 wt%로 은 분말의 함량을 줄였음에도 불구하고 비저항은 7.04×10-5Ω·cm로 가장 우수한 값을 보였다. 이 결과는 판상형 은 분말이 구형 분말 사이의 전도성 연결을 개선하여 전기가 흐르기 용이하도록 만들어 주었기 때문이다.

Keywords: photosensitive silver pastes; electrical conductivity; fine electrode pattern; particle shape effect

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2015; 39(4): 662-667

    Published online Jul 25, 2015

  • 10.7317/pk.2015.39.4.662
  • Received on Feb 4, 2015
  • Accepted on Feb 27, 2015