Article
  • Curing and Heat Stability of Epoxy Encapsulants with Polysilazane Cross-linking Agent
  • Piao L, Kim JK
  • 폴리실라잔 가교제를 이용한 LED 에폭시 봉지재의 경화와 열 안정성 연구
  • 박용해, 김진권
Abstract
Bisphenol A epoxy and silicone-epoxy LED encapsulants were cured by using polysilazane cross-linking agents, which could be used to initiate the ring-opening polymerization of epoxy group, and the heat stabilities of the encapsulants were examined. Bisphenol A epoxy encapsulants cured by polysilazane showed better heat stability than that with conventional organic cross-linking agents due to the superior heat stability of silicon-based polysilazane cross-linking agent. Silicone-epoxy encapsulants also presented excellent heat stability owing to the high silicon content of polysilazane cross-linking agent. In order to increase the refractive index of the silicone-epoxy encapsulants, TiO2 nanoparticles were dispersed in the silicone-epoxy and cured by polysilazane. The relationship between the refractive index and the TiO2 content was investigated.

본 연구에서는 에폭시 그룹과 가교반응하는 폴리실라잔 가교제를 이용하여 LED용 비스페놀 A 에폭시 봉지 재와 실리콘-에폭시 봉지재를 경화시키고 열 안정성을 연구하였다. 비스페놀 A 에폭시 봉지재는 열 안정성이 높은 실리콘 기반의 반응성 폴리실라잔 가교제를 사용함으로써 기존의 저분자 유기 가교제를 사용할 때에 비해 월등히 높은 열 안정성을 보였고, 실리콘-에폭시 봉지재는 실리콘 함량의 저하 없이 경화시킴으로써 높은 열 안정성을 유지하는데 도움이 되었다. 또한 실리콘 봉지재의 굴절률이 낮은 단점을 보완하기 위해 굴절률이 높은 TiO2 나노입자와 실리콘-에폭시, 폴리실라잔 복합체를 형성하여 입자함량이 굴절률에 미치는 영향을 연구하였다.

Keywords: polysilazane; encapsulation; light-emitting diode; epoxy resin

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2015; 39(5): 733-738

    Published online Sep 25, 2015

  • 10.7317/pk.2015.39.5.733
  • Received on Feb 9, 2015
  • Accepted on May 15, 2015