Article
  • Plasma Polymerization of Hexamethyldisiloxane : Effect of Substrate Temperature
  • Lee KP, Park SY, Kim N, Song SK
  • 헥사메틸디실록산의 플라즈마중합: 기판온도의 영향
  • 이기풍, 박수영, 김낙중, 송석규
Abstract
The chemical structure, surface free energy, and deposition rate of hexamethyldisiloxane (HMDSIO) were investigated in terms of the discharge power(W), mass flow rate(Fm) and substrate temperature(Ts). It was observed that both the substrate temperature and the input engery (W/Fm) level of grow discharge significantly controlled the chemical structure and surface energy of plasma polymer. It was found that the deposition rates of HMDSIO could be properly described as a function of W/Fm and Ts as follows. DRm(W, Fm, Ts)=C x Fm x exp(-Ea/(W/Fm)) x exp(-bTs)

헥사메틸디실록산의 플라즈마중합시 방전출력(W), 단량체 공급속도(Fm) 및 기질 (substrate)의 온도(Ts)가 중합체의 화학구조, 표면자유에너지, 그리고 증착속도(DRm)에 미치는 영향을 연구하였다. 복합에너지 변수(W/Fm)와 기질의 온도에 따라 중합체의 이들 물성은 체계적으로 변화하였는데, 이러한 특성은 '활성화 성장기구'에 의해 설명될 수 있었다. 특히 복합에너지변수와 기질의 온도가 헥틸메칠디실록산의 증착속도에 미치는 영향을 조사하여 다음의 관계식을 얻을 수 있었다. DRm(W, Fm, Ts)=C x Fm x exp(-Ea/(W/Fm)) x exp(-bTs)

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1991; 15(1): 88-94

    Published online Feb 25, 1991