This study aimed to prevent blooming and improve the flame retardancy of the resin by synthesizing reactive phosphorus flame retardants and forming a network structure together with resins and curing agents. Through the nucleophilic substitution reaction of phosphorus chloride and acrylic reactants, Tris[2-(methacryloyloxy)ethyl]phosphate (TMOEP), bis(methacryloyloxyethyl)phenyl phosphate (BMOEPP), and methacryloyloxyethyl diphenyl phosphate (MOEDPP) were synthesized. Curing conditions were established through thermal analysis and curing degree measurement, flame retardancy and thermal properties were evaluated, and the action of the flame retardant in a solid phase was confirmed through char formation. As a result, BMOEPP showed the best flame retardancy performance. Through the results of this study, the mechanism for improving the flame retardancy of resin using reactive phosphorus flame retardants was identified, and the applicability of this to high-performance printed circuit board (PCB) materials was suggested.

본 연구에서는 반응성 인계 난연제를 합성하고 수지, 경화제와 네트워크 구조를 형성함으로써 블루밍 현상을 방지하고 수지의 난연성을 향상시키는 것이 목표이다. 인 염화물과 아크릴계 반응물의 친핵성 치환반응을 이용하여, tris[2-(methacryloyloxy)ethyl]phosphate(TMOEP), bis(methacryloyloxyethyl)phenyl phosphate(BMOEPP), methacryloyloxyethyl diphenyl phosphate(MOEDPP) 총 3종의 난연제를 합성하였다. 열분석 및 경화도 측정을 통해 경화 조건을 확립하고, 난연성 및 열적 특성을 평가하였으며, char 형성을 통해 고상에서의 난연제의 작용을 확인하였다. 그 결과, BMOEPP가 가장 우수한 난연 성능을 보였다. 본 연구 결과를 통해 반응성 인계 난연제를 활용한 수지의 난연성 향상 메커니즘을 규명하고, 이를 고성능 printed circuit board(PCB) 소재에 적용가능성을 제시하였다.

Keywords: reactive flame retardant, printed circuit board, methyl methacrylate terminated poly(phenylene oxide), UL-94 vertical burning test.