• Evaluation of Peeling Property of Polyisoprene-Based Pressure Sensitive Adhesive

  • You Sub Kim, Hui Jae Cho, Yong Chan Jung*,† , and Soo Yeol Lee†

  • Department of Materials Science Engineering, Chungnam National University, 99 Daehakro, Yuseong-gu, Daejeon 34134, Korea
    *Creative Future Laboratory, KEPCO Research Institute, 105 Munjiro, Yuseong-gu, Daejeon 34056, Korea

  • 폴리이소프렌 감압 접착제의 박리특성 평가

  • 김유섭 · 조희재 · 정용찬*,† · 이수열†

  • 충남대학교 신소재공학과, *한전 전력연구원 창의미래연구소

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2024 Impact Factor : 0.6
  • Indexed in SCIE

This Article

  • 2019; 43(1): 1-9

    Published online Jan 25, 2019

  • 10.7317/pk.2019.43.1.1
  • Received on Apr 12, 2018
  • Revised on Aug 18, 2018
  • Accepted on Oct 2, 2018

Correspondence to

  • Yong Chan Jung* , and Soo Yeol Lee

  • Department of Materials Science Engineering, Chungnam National University, 99 Daehakro, Yuseong-gu, Daejeon 34134, Korea
    *Creative Future Laboratory, KEPCO Research Institute, 105 Munjiro, Yuseong-gu, Daejeon 34056, Korea

  • E-mail: 007mrjung@gmail.com, sylee2012@cnu.ac.kr