• Investigation into the Thermal Stability of Fluoropolymer Coating for Heat-Resistant Application
  • Cho HJ, Ryu J, Byun DJ, Choi KY
  • 내열성 불소수지 코팅막의 열 안정성에 관한 연구
  • 조혜진, 류주환, 변두진, 최길영
Abstract
Fluoropolymer of PTFE and PFA etc. is a heat resistance polymeric material that it is known as that maximum continuous use temperature reaches for 260 ℃. It was observed that these polymers had the enough thermal stability so enough that it was kept by thermal aging of 280 ℃/7 weeks too in this study. However, such thermal stability means that bulk material property is kept such as mechanical strength, melting point and initial pyrolysis temperature etc. If these polymers are evaluate by coating property such as surface contact angle, surface morphology, surface scratch, thing that heat resistance is not enough was confirmed in this study. Thermal aging of flouropolymer coating was achieved by gear aging oven that the exchange rate of air was controlled, and the analysis results were indicating serious damage of surface morphology and adhesive strength on metal substrate.

PTFE 및 PFA 등의 불소수지는 최대 연속 사용 온도가 260 ℃에 달하는 고온 내열성 고분자 소재로서, 본 연구에서 수행된 280 ℃, 7주 간의 열노화에 의해서도 충분한 열적 안정성이 유지됨을 관측하였다. 그러나 기계적 강도, 융점 및 열분해 개시 온도 등의 소재적 물성이 유지됨을 의미하는 상기한 열적 안정성은 본 연구에서 수행된 코팅막으로서의 표면접촉각, 미세 모폴로지, 내스크래치성 분석에 의한 방법을 기준하면 충분하지 못하다는 것이 확인 되었다. 공기 치환율이 제어되는 기어식 노화시험기로 진행된 불소수지 코팅막의 280 ℃ 열노화에 대한 분석의 결과는 심각한 표면 모폴로지의 손상과 금속기재에 대한 접착력의 손실을 지적하고 있다.

Keywords: thermal stability; fluoropolymer coating; interface adhesion

References
  • 1. Pompe G, Lappan U, Haussler L, Thermochim. Acta, 391(1-2), 257 (2002)
  •  
  • 2. Briscoe BJ, Mahgerefteh H, Suga S, Polymer, 44(3), 783 (2003)
  •  
  • 3. Shim HH, Kwon OK, Journal of KSTLE, 11, 28 (1995)
  •  
  • 4. Zhang J, Xu L, Yu X, Liu X, Mater. Lett., 56, 410 (2002)
  •  
  • 5. Price DM, Jarratt M, Thermochim. Acta, 392-393(-), 231 (2002)
  •  
  • 6. Wang CB, Yan MF, Wang Y, Tribol. Int., 37, 645 (2004)
  •  
  • 7. Lu XC, Wen SZ, Tong J, Chen YT, Ren LQ, Wear, 193, 48 (1996)
  •  
  • 8. Licari JJCoating Materials for Electronic Applictions, Noyes Publications, William Andrew. Inc, p 185 (2003)
  •  
  • 9. Eriksson PA, Boydell P, Eriksson K, Manson JA, Albertsson AC, J. Appl. Polym. Sci., 65(8), 1619 (1997)
  •  
  • 10. Piccirelli N, Shanahan MER, Polymer, 41(11), 4077 (2000)
  •  
  • 11. Peng G, Geng H, Tang D, He S, Radiat. Phys. Chem., 69, 183 (2004)
  •  
  • 12. Burger W, Lunkwitz K, J. Fluor. Chem., 54, 80 (1991)
  •  
  • 13. Schierholz K, Lappan C, Petr A, Dunsch L, Lunkwitz K, J. Polym. Sci. B: Polym. Phys., 37(17), 2404 (1999)
  •  
  • 14. Ferry L, Vigier G, Alexander-Katz R, Garapon C, J. Polym. Sci. B: Polym. Phys., 36(12), 2057 (1998)
  •  
  • 15. Lappan U, Fuchs B, Geissler U, Scheler U, Lunkwitz K, Polymer, 43(16), 4325 (2002)
  •  
  • 16. Schierholz K, Lappan U, Lunkwiz K, Nucl. Instrum. Methods Phys. Res. Sect. B-Beam Interact. Mater. Atoms, 151, 232 (1999)
  •  
  • 17. Lappan U, Geibler U, Haubler L, Jehnichen D, Pompe G, Lunkwitz K, Nucl. Instrum. Methods Phys. Res. Sect. B-Beam Interact. Mater. Atoms, 185, 178 (2001)
  •  
  • 18. Fischer D, Lappan U, Hopfe I, Eichhorn KJ, Lunkwitz K, Polymer, 39(3), 573 (1998)
  •  
  • 19. Lunkwitz K, Ferse A, Brink HJ, Handte D, Gross U, J. Fluor. Chem., 29, 234 (1985)
  •  
  • 20. Gitis NV, Xiao J, Vinogradov MProceedings of 26th Annual Meeting of The Adhesion Society, 133 (2003)
  •  
  • 21. Gotoh K, Nakata Y, Tagawa M, Tagawa M, Colloids Surf. A: Physicochem. Eng. Asp., 224, 165 (2003)
  •  
  • 22. Piccirelli N, Shanahan MER, Polymer, 41(11), 4077 (2000)
  •  
  • 23. Zhang J, Wu Q, Yu X, Zha P, Li H, Mater. Lett., 48, 362 (2001)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2024 Impact Factor : 0.6
  • Indexed in SCIE

This Article

  • 2005; 29(1): 96-101

    Published online Jan 25, 2005

  • Received on Nov 25, 2004
  • Accepted on Jan 14, 2005